MagnaChip Announces Cost Competitive 0.13 micron Slim Flash Process Technology
The embedded NVM (Non-Volatile Memory) EEPROM process, integrates logic, analog, and memory into one chip, and has been adopted in a wide range of applications such as automotive, MCU, touch IC and Auto Focus IC.
Qualification test for 0.13 micron Slim Flash process technology was completed in both device performance and yield categories. All devices passed the WLR (Wafer Level Reliability) test,
In addition to the existing 0.13 micron EEPROM, MagnaChip plans to build a Slim Flash portfolio by merging Slim Flash into various technologies, including BCD and High Voltage. MagnaChip is currently engaging with customers using the new technology, with several products currently in development. Volume production of the Slim Flash process technology is expected to begin as early as the fourth quarter of 2016.
"With the introduction of our 0.13 micron Slim Flash process technology, customers now have access to a cost-saving and time-saving manufacturing process that will improve their overall time to market," said YJ Kim, Chief Executive Officer of MagnaChip.
About MagnaChip Semiconductor Corporation
MagnaChip is a
For more information, please visit www.magnachip.com. Information on or accessible through, MagnaChip's website is not a part of, and is not incorporated into, this release.
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