MagnaChip Offers Automotive Qualified 0.18um Semiconductor Manufacturing Process Technology
This 0.18um automotive process technology consists of modular processes which combine 1.8V/3.3V CMOS, 52V LDMOS/EDMOS, fully isolated 32V nLDMOS and embedded MTP/EEPROM. MagnaChip's proprietary electrical fuse OTP is also included for precision analog trimming. Full combinations of these modular processes serve a wide range of automotive semiconductor SOC products such as, but not limited to, LED lighting, motor drivers, microcontrollers and ASICs.
This process technology is specially designed for reliable operation at high temperatures and is fully AEC compliant conforming to AEC Q100 Grade 0 specification at 150 degrees C. For example, leakage current of 1.8V rated CMOS devices at 150 degrees C is reduced to ΒΌ of the leakage of 1.8V CMOS of baseline technologies. Endurance of MTP and EEPROM is 100K cycle and 10K cycle at 150 degrees C, respectively. SPICE model and MTP/EEPROM operation is verified up to 175 degrees C. In addition, high density standard cell libraries,
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In the United States: Robert Pursel Director of Investor Relations Tel. +1-408-625-1262 |
In Korea: Chankeun Park Senior Manager, Public Relations Tel. +82-3-6903-3195 |
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